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HP Boasts Cooler BladeCenter

PALO ALTO, Calif. -- HP (NYSE:HPQ - News) today announced benchmark results confirming the HP BladeSystem c-Class uses up to 27 percent less power than the IBM BladeCenter-H in similar configurations that reflect real-world customer usage of blade server environments.(1)

The results derive from a week-long study conducted by Sine Nomine Associates of Ashburn, Va., which examined the overall power consumption and external airflow requirements of a variety of blade server and 1U rack server configurations in a typical data center environment experiencing light to heavy use.

The documented and publicly available results demonstrate that the HP BladeSystem c-Class and its zoned cooling properties not only lower power usage through efficient power distribution but also optimize airflow, which is a significant component in keeping data centers cool. In fact, the benchmark study shows the HP BladeSystem c-Class requires 60 percent less airflow than the IBM BladeCenter-H.

HP, the new industry leader in factory revenues and units shipped for blade servers,(2) features HP Thermal Logic technology in its BladeSystem enclosure to offer customers reduced power and cooling loads right out of the box.

"Power and cooling are serious issues for customers," said Mark Potter, vice president, BladeSystem Division, HP. "Sine Nomine took an objective look at this real-world customer problem and the test results show what we already knew: HP BladeSystem c-Class featuring Thermal Logic is the clear choice for customers addressing their power and cooling challenges."

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