Gennum Shows Chips for 16-G Fibre Channel
Gennum unveils world's first complete IC solution for 16G Fibre Channel SFP+
March 24, 2009
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SAN DIEGO -- Allowing the industry to rapidly migrate to the next node in Fibre Channel development (16GFC), Gennum Corporation (TSX: GND) today announced the immediate availability of the worlds first 16GFC SFP+ complete integrated circuit (IC) solution. The solution is comprised of a clock and data recovery (CDR) (with integrated limiting amplifier) IC, a CDR with integrated equalizer/laser driver IC, and a transimpedance amplifier (TIA). The new ICs represent the most comprehensive 16GFC SFP+ solution on the market, while delivering the robust performance required by networking and storage applications. Gennum is demonstrating the new ICs and a corresponding SFP+ reference design at the Optical Fiber Conference and National Fiber Optics Engineers Conference (OFC/NFOEC) this week.
“By leveraging our proven CDR and TIA technologies, we are first to market with a robust SFP+ IC solution that meets the jitter, cost, and power demands of next-generation 16G Fibre Channel applications,” said Bharat Tailor, Director of Marketing for Networking, Storage and Computing for Gennum Corporation. “This comprehensive solution will enable our customers to begin 16G Fiber Channel SFP+ module development today, giving them a critical time-to-market advantage.” The company said it has already sampled the devices to several major module suppliers. Gennum is a market share leader in both TIAs and CDRs at 8.5G/10G rates, having shipped over 6 million TIAs and CDRs to date.
Gennum Corp.
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