Flextronics Unveils New Chip

SINGAPORE -- Flextronics today unveiled its new G700Quad-Core platform for OEM and ODM designs. The scalable G700 utilizes theQuad-Core Intel(R) Xeon(R) processor E5335 and the Intel(R) 5000P chipsetand maximizes available PCI Express I/O through modularity.

"We developed a flexible rackmount platform containing two Quad-CoreIntel(R) processors for customers seeking a high-performance, scalablesolution for various networking, security and storage applianceapplications," said Sean Burke, President of Flextronics' Computing Segment."With its modular I/O approach, OEM and ODM customers can increase value toend users and offer various G700 models with options for gigabit Ethernet(copper and fiber), 10GbE, Infiniband, storage, security acceleration forIPSec and SSL and many more modular options."

Burke added, "Today's announcement underscores our commitment to provide OEMand ODM customers with the right platforms and technologies to increasetheir competitiveness in a dynamic market. Flextronics' ability to designand manufacture Intel Architecture based motherboards and solutions supportsour strategy to deliver enhanced services to our customers, and reinforcesour position as a leader in advanced ODM and EMS products and services forcustomer branded systems and solutions."

Flextronics Corp.