"We're injecting atomic layers of air between the processors -- that will increase dissipation of heat by 40 percent," Lechner claims. This will be available on IBM's cell processors sometime in the next 12 to 24 months, and it eventually will be extended to the vendor's other chip technologies.
IBM is also enhancing its "variable fan" technology, which uses heat monitors to control the speed of the fans within its servers. "If you can get them to spin at a variable rate based on monitoring, you can cut energy [demands] by half," said Lechner. "That's in place on our System P servers right now. You will find that on our storage arrays next year."
Another vendor looking to control the speed of its hardware components is EMC, which recently announced plans to "spin down" the disks on its storage arrays in an attempt to harness energy costs.
A number of vendors, including Copan and Nexsan, already tout disk-based power-saving technology, and IBM now looks set to follow.
"What EMC is looking at in terms of innovating at the disk level, we are as well," said Lechner, although he did not reveal any additional product details.
By combining resources and expertise, the AI-Enabled ICT Workforce Consortium will offer a blueprint for how industries can adapt to an AI-dominated future.
IT leaders should heed the guidance of cybersecurity insurance providers who think businesses should prioritize security education, incident preparedness, regular internal audits, and ongoing vulnerability scanning and patching.
There are many network courses that can address your present job's priorities and help you gain the needed skills to keep pace with industry changes and new technologies.
